Improve the flatness and smoothness of the mounting surface and sealing surface of the traveling wave tube

Determining the dimensions of the sealing groove and the sealing ring

The main objective of this design is to ensure both effective sealing and efficient heat dissipation for the chassis. To achieve this, we will review the dimensions specified in the production drawings and discuss their feasibility with colleagues. The outer part of the sealing groove is intentionally oversized to create a thermal resistance layer between the two plates, which helps control heat transfer. However, the exposed portion is relatively small, and due to machining tolerances and potential deformation, the sealing performance may not be fully guaranteed. To address these issues, it's essential to improve the flatness and surface finish of both the traveling wave tube mounting area and the sealing surface. Enhancing these features reduces thermal resistance and improves the overall sealing effect. Based on previous experience, we recommend maintaining a flatness of 0.08 mm for both surfaces. Additionally, the surface roughness should be kept within acceptable limits to ensure proper contact and minimize air gaps that could compromise sealing or thermal performance. Installation guidelines for the traveling wave tube: 1) Before installation, verify that the flatness of the mounting surface is 0.08 mm. If it doesn't meet this standard, re-machine the surface. 2) Apply a thin layer of thermal paste between the traveling wave tube and the heat sink, but avoid over-application. After applying, place the tube on the heat sink several times to ensure even distribution of the paste before tightening. 3) After installation, the clearance between the traveling wave tube and the heat dissipation plate should be less than 0.1 mm. This ensures good thermal contact while preventing mechanical stress. 4) Thermal grease should be stored properly under normal conditions—avoid drying out or contamination, as this can affect its performance. Fan installation: Currently, there are two common methods shown on the drawings. The first involves the fan drawing air from the side of the traveling wave tube, while the second involves blowing air directly onto the power supply. Testing has shown that the first method is more effective. However, if the fan can be angled to blow diagonally along the length of the traveling wave tube, the cooling efficiency improves further. One key issue with the current installations is that the airflow from the fan is limited in circulation. The air tends to stay close to the fan, leading to uneven temperature distribution inside the chassis. This can result in hotspots, reducing the overall thermal management effectiveness. Therefore, optimizing the airflow direction and ensuring better circulation is crucial for long-term reliability and performance.

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