Determining the dimensions of the sealing groove and the sealing ring is a critical step in ensuring both effective sealing and efficient heat dissipation for the chassis. To better understand the design, we will review the dimensions provided on the production drawings and discuss their feasibility with our peers. The outer part of the groove is intentionally oversized to create a thermal resistance between the two plates, which helps in managing heat transfer. However, the exposed portion is small, and due to machining errors and potential deformation, this can compromise the sealing performance. Therefore, it's essential to ensure proper alignment and surface quality.
Improving the flatness and surface finish of the traveling wave tube mounting area and the sealing surface plays a key role in reducing thermal resistance and enhancing the sealing effect. Based on past experience, we recommend that the flatness of these surfaces should be no more than 0.08 mm. Additionally, the surface roughness should be controlled to ensure optimal contact and minimal air gaps. These improvements help in achieving better thermal conductivity and a more reliable seal.
Installation requirements for the traveling wave tube include the following steps: First, verify that the flatness of the mounting surface is within 0.08 mm. If not, re-machining or grinding may be necessary. Next, apply a thin layer of thermal grease between the traveling wave tube and the heat sink—too much grease can reduce efficiency. After applying, place the tube on the heat sink several times to evenly distribute the grease before tightening. Finally, ensure that the clearance between the traveling wave tube and the heat dissipation plate is less than 0.1 mm. Thermal grease should be stored properly, avoiding excessive drying or contamination to maintain its effectiveness.
Regarding fan installation, there are currently two methods shown on the drawings: one where the fan draws air from the side of the traveling wave tube, and another where it blows directly onto the power supply. Testing has shown that the first method performs better, but if the fan can blow at an angle along the traveling wave tube, the cooling effect improves further. The main drawback of these two configurations is that the airflow is limited, leading to uneven temperature distribution inside the chassis. This highlights the importance of optimizing fan placement to ensure more uniform cooling and better overall thermal management.
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